CD4512BCM
vs
HCF4512BC1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
| Package Description |
PLASTIC, SO-16
|
QCCJ, LDCC20,.4SQ
|
| Reach Compliance Code |
compliant
|
compliant
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
9.9 mm
|
8.965 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
3
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP16,.25
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
750 ns
|
400 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.9 mm
|
8.965 mm
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| HTS Code |
|
8542.39.00.01
|
| Load Capacitance (CL) |
|
50 pF
|
| Prop. Delay@Nom-Sup |
|
360 ns
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare HCF4512BC1 with alternatives