HCF4512BC1
vs
HD14512BFP
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QLCC
|
SOIC
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
SOP,
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
|
| Length |
8.965 mm
|
10.06 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
8
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Prop. Delay@Nom-Sup |
360 ns
|
|
| Propagation Delay (tpd) |
400 ns
|
750 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.2 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.965 mm
|
5.5 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare HCF4512BC1 with alternatives
Compare HD14512BFP with alternatives