CD4511BD
vs
MC14511BCPDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
COMMON-CATHODE
Display Mode
SEGMENT
JESD-30 Code
R-XDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Number of Segments
7
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
3
Part Package Code
DIP
Pin Count
16
Family
4000/14000/40000
Input Conditioning
LATCHED
Length
20.07 mm
Load Capacitance (CL)
50 pF
Logic IC Type
SEVEN SEGMENT DECODER/DRIVER
Number of Functions
1
Output Polarity
TRUE
Propagation Delay (tpd)
1440 ns
Seated Height-Max
4.69 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Width
7.62 mm
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