CD4511BD vs CD4511BMN feature comparison

CD4511BD Harris Semiconductor

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CD4511BMN National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature COMMON-CATHODE
Display Mode SEGMENT
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Number of Segments 7
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 3
Family 4000/14000/40000
Input Conditioning LATCHED
Load Capacitance (CL) 50 pF
Logic IC Type SEVEN SEGMENT DECODER/DRIVER
Number of Functions 1
Output Polarity TRUE
Propagation Delay (tpd) 1440 ns
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V

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