CD4086BD vs HEF4086BDB feature comparison

CD4086BD Texas Instruments

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HEF4086BDB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description CERAMIC, DIP-14 DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature EXPANDABLE EXPANDABLE
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-GDIP-T14
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 620 ns 180 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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