CD4073BCN vs HEF4073BDB feature comparison

CD4073BCN National Semiconductor Corporation

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HEF4073BDB NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 19.215 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1

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