CD4067BD
vs
HEF4067BPB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
RCA SOLID STATE
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP, DIP24,.6
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-XDIP-T24
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
|
| Number of Channels |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| On-state Resistance-Max (Ron) |
1300 Ω
|
175 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Signal Current-Max |
0.025 A
|
|
| Supply Current-Max (Isup) |
3 mA
|
0.6 mA
|
| Surface Mount |
NO
|
NO
|
| Switch-on Time-Max |
650 ns
|
100 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
6
|
1
|
| Length |
|
31.7 mm
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Off-state Isolation-Nom |
|
50 dB
|
| On-state Resistance Match-Nom |
|
5 Ω
|
| Seated Height-Max |
|
5.1 mm
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Switch-off Time-Max |
|
340 ns
|
| Width |
|
15.24 mm
|
|
|
|
Compare HEF4067BPB with alternatives