CD4050UBDT vs HCF4010BEY feature comparison

CD4050UBDT Texas Instruments

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HCF4010BEY STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code SOIC DIP
Package Description SOP, SOP16,.25 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDIP-T16
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR TUBE
Prop. Delay@Nom-Sup 140 ns 200 ns
Propagation Delay (tpd) 140 ns 200 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 5.1 mm
Supply Voltage-Max (Vsup) 15 V 20 V
Supply Voltage-Min (Vsup) 5 V 3 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Rohs Code Yes
Additional Feature HIGH TO LOW LEVEL TRANSLATOR
JESD-609 Code e3
Output Characteristics OPEN-DRAIN
Terminal Finish MATTE TIN

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