CD4050BF vs TC4050BFN(TP2) feature comparison

CD4050BF Texas Instruments

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TC4050BFN(TP2) Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code DIP SOIC
Package Description CERAMIC, DIP-16 SOP,
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature CMOS-TTL LEVEL TRANSLATOR IOH = 1.9MA @ VOH = 2.5V; IOL = 2.9MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0
Length 19.56 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0064 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Power Supply Current-Max (ICC) 0.06 mA
Prop. Delay@Nom-Sup 140 ns
Propagation Delay (tpd) 140 ns 70 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 4 1

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