CD4050BCN
vs
HEF4050BDB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
Additional Feature
CMOS-TTL LEVEL TRANSLATOR
CMOS-TTL LEVEL TRANSLATOR
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e3
Length
19.305 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
NOT APPLICABLE
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
120 ns
70 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
7.62 mm
Base Number Matches
4
1
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
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