HEF4050BDB
vs
HEF4050BPN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CMOS-TTL LEVEL TRANSLATOR
Family
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
Number of Inputs
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
70 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e3
Max I(ol)
0.00035999999999999997 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
110 ns
Schmitt Trigger
NO
Terminal Finish
Matte Tin (Sn)
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