CD4024BDMS vs HEF4024BDB feature comparison

CD4024BDMS Harris Semiconductor

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HEF4024BDB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 7 7
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 486 ns 200 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
fmax-Min 12 MHz 5 MHz
Base Number Matches 3 1
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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