CD40174BM
vs
HEF40175BT-T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
DIE
SOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-XUUC-N16
R-PDSO-G16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
4
Number of Functions
6
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Propagation Delay (tpd)
420 ns
160 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
6 MHz
20 MHz
Base Number Matches
2
1
Part Package Code
SOIC
Pin Count
16
JESD-609 Code
e4
Length
9.9 mm
Load Capacitance (CL)
50 pF
Seated Height-Max
1.75 mm
Technology
CMOS
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
1.27 mm
Width
3.9 mm
Compare CD40174BM with alternatives
Compare HEF40175BT-T with alternatives