CCR75CH150JP
vs
CCR75CH150JM
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
AVX CORP
|
AVX CORP
|
Package Description |
,
|
,
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8532.24.00.40
|
8532.24.00.40
|
Capacitance |
0.000015 µF
|
0.000015 µF
|
Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
Diameter |
2.29 mm
|
2.29 mm
|
Dielectric Material |
CERAMIC
|
CERAMIC
|
JESD-609 Code |
e0
|
e0
|
Length |
4.07 mm
|
4.07 mm
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Multilayer |
Yes
|
Yes
|
Negative Tolerance |
5%
|
5%
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Package Style |
Axial
|
Axial
|
Packing Method |
BULK
|
BULK
|
Positive Tolerance |
5%
|
5%
|
Rated (DC) Voltage (URdc) |
200 V
|
200 V
|
Reference Standard |
MIL-PRF-20
|
MIL-PRF-20
|
Surface Mount |
NO
|
NO
|
Temperature Characteristics Code |
CH
|
CH
|
Temperature Coefficient |
60ppm/Cel ppm/°C
|
60ppm/Cel ppm/°C
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Shape |
WIRE
|
WIRE
|
Base Number Matches |
2
|
2
|
Factory Lead Time |
|
16 Weeks
|
|
|
|
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