CC1310F64RGZ
vs
CC1310F128RGZR
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
HVQCCN,
|
VQFN-48
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PQCC-N48
|
S-PQCC-N48
|
Length |
7 mm
|
7 mm
|
Number of Terminals |
48
|
48
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
ECCN Code |
|
5A992.C
|
Samacsys Manufacturer |
|
Texas Instruments
|
CPU Family |
|
CORTEX-M3
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
RAM (bytes) |
|
28672
|
Supply Voltage-Nom |
|
3.3 V
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CC1310F64RGZ with alternatives
Compare CC1310F128RGZR with alternatives