CC1310F64RGZ
vs
EZR32LG230FE55G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
SILICON LABORATORIES INC
Package Description
HVQCCN,
HVQCCN,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PQCC-N48
S-XQCC-N64
Length
7 mm
9 mm
Number of Terminals
48
64
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max
1 mm
0.9 mm
Supply Voltage-Max
3.8 V
3.8 V
Supply Voltage-Min
1.8 V
1.98 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
7 mm
9 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
MICROPROCESSOR CIRCUIT
Base Number Matches
1
1
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
3 V
Temperature Grade
INDUSTRIAL
Compare CC1310F64RGZ with alternatives
Compare EZR32LG230FE55G with alternatives