CC1000PW
vs
MAX2363EGM-TD
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SSOP
|
|
| Package Description |
4.40 MM, ROHS COMPLIANT, TSSOP-28
|
7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
5A991.G
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| JESD-30 Code |
R-PDSO-G28
|
S-XQCC-N48
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.7 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP28,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Current-Max |
0.001 mA
|
|
| Supply Voltage-Nom |
3 V
|
2.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
7 mm
|
| Base Number Matches |
4
|
1
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare CC1000PW with alternatives
Compare MAX2363EGM-TD with alternatives