MAX2363EGM-TD
vs
CC1070-RTY1
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48
|
5 X 5 MM, ROHS COMPLIANT, QFN-20
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N20
|
JESD-609 Code |
e0
|
|
Length |
7 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
20
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Nom |
2.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
5 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
QFN
|
Pin Count |
|
20
|
Package Equivalence Code |
|
LCC20,.20SQ,25
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MAX2363EGM-TD with alternatives
Compare CC1070-RTY1 with alternatives