CAT93C56LE-G vs S-93C56ADP-1A feature comparison

CAT93C56LE-G Catalyst Semiconductor

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S-93C56ADP-1A Epson Electronics America Inc

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CATALYST SEMICONDUCTOR INC SEIKO EPSON CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 8
Clock Frequency-Max (fCLK) 0.25 MHz 0.25 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e4
Length 9.27 mm 9.6 mm
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X16 128X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 5.08 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm 7.62 mm
Base Number Matches 5 1
Write Cycle Time-Max (tWC) 10 ms

Compare CAT93C56LE-G with alternatives

Compare S-93C56ADP-1A with alternatives