CAT22C10PA-30
vs
X22C11DI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
XICOR INC
Part Package Code
DIP
Package Description
PLASTIC, DIP-18
0.300 INCH, HERMETIC SEALED, CERDIP-18
Pin Count
18
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
300 ns
120 ns
JESD-30 Code
R-PDIP-T18
R-GDIP-T18
JESD-609 Code
e0
e0
Length
21.97 mm
Memory Density
256 bit
256 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
18
18
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64X4
64X4
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
1
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
NO
Package Equivalence Code
DIP18,.3
Compare CAT22C10PA-30 with alternatives
Compare X22C11DI with alternatives