CA0555CM
vs
LM555J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
NATIONAL SEMICONDUCTOR CORP
Package Description
SOP,
CERAMIC, DIP-8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-PDSO-G8
R-GDIP-T8
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max (Isup)
15 mA
12 mA
Supply Voltage-Max (Vsup)
16 V
18 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
4
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP8,.3
Seated Height-Max
5.08 mm
Technology
BIPOLAR
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare CA0555CM with alternatives
Compare LM555J with alternatives