C1808X511FGGALTU
vs
C1808X511FGGAC
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
KEMET ELECTRONICS CORP
|
KEMET ELECTRONICS CORP
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.24.00.20
|
8532.24.00.20
|
| Capacitance |
0.00051 µF
|
0.00051 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
1.6 mm
|
1.6 mm
|
| JESD-609 Code |
e0
|
e3
|
| Length |
4.7 mm
|
4.7 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
1%
|
1%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR, EMBOSSED PLASTIC, 7 INCH
|
BULK
|
| Positive Tolerance |
1%
|
1%
|
| Rated (DC) Voltage (URdc) |
2000 V
|
2000 V
|
| Size Code |
1808
|
1808
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
C0G
|
C0G
|
| Temperature Coefficient |
30ppm/Cel ppm/°C
|
30ppm/Cel ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare C1808X511FGGALTU with alternatives
Compare C1808X511FGGAC with alternatives