C1005X8R1H103K050BB vs CGA2B3X8R1H103K050BD feature comparison

C1005X8R1H103K050BB TDK Corporation

Buy Now Datasheet

CGA2B3X8R1H103K050BD TDK Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TDK CORP TDK CORP
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 28 Weeks 28 Weeks
Capacitance 0.01 µF 0.01 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 0.5 mm 0.5 mm
JESD-609 Code e3
Length 1 mm 1 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, 7 INCH TR, 7 INCH
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 50 V 50 V
Size Code 0402 0402
Surface Mount YES YES
Temperature Characteristics Code X8R X8R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish MATTE TIN OVER NICKEL SILVER PALLADIUM COPPER
Terminal Shape WRAPAROUND WRAPAROUND
Width 0.5 mm 0.5 mm
Base Number Matches 1 1
Reference Standard AEC-Q200

Compare C1005X8R1H103K050BB with alternatives

Compare CGA2B3X8R1H103K050BD with alternatives