BZX84-A11,215
vs
MMBZ5240B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
GENERAL INSTRUMENT CORP
Part Package Code
TO-236
Package Description
PLASTIC PACKAGE-3
Pin Count
3
Manufacturer Package Code
SOT23
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Factory Lead Time
4 Weeks
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
20 Ω
JEDEC-95 Code
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
3
2
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.25 W
0.5 W
Reference Standard
AEC-Q101; IEC-60134
Reference Voltage-Nom
11 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
1%
5%
Working Test Current
5 mA
20 mA
Base Number Matches
2
37
Qualification Status
Not Qualified
Compare BZX84-A11,215 with alternatives
Compare MMBZ5240B with alternatives