BZX79-C47
vs
1N6016B-AP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRO COMMERCIAL COMPONENTS
Part Package Code
DO-35
DO-35
Package Description
HERMETIC SEALED, GLASS, SC-40, 2 PIN
O-XALF-W2
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
170 Ω
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-XALF-W2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
CECC50005-005
Reference Voltage-Nom
47 V
47 V
Reverse Current-Max
0.05 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
10
Voltage Temp Coeff-Max
51.8 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
2 mA
2 mA
Base Number Matches
7
1
Additional Feature
HIGH RELIABILITY
Compare BZX79-C47 with alternatives
Compare 1N6016B-AP with alternatives