BZX79-C24T/R
vs
BZX79C24-AP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICRO COMMERCIAL COMPONENTS
|
Part Package Code |
DO-35
|
DO-35
|
Package Description |
HERMETIC SEALED, GLASS, SC-40, 2 PIN
|
O-LALF-W2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
70 Ω
|
70 Ω
|
JEDEC-95 Code |
DO-35
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e3
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
CECC50005-005
|
|
Reference Voltage-Nom |
24 V
|
24 V
|
Reverse Current-Max |
0.05 µA
|
0.05 µA
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Temp Coeff-Max |
22 mV/°C
|
|
Voltage Tol-Max |
5%
|
5.79%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
Yes
|
Additional Feature |
|
METALLURGICAL BONDED
|
Forward Voltage-Max (VF) |
|
0.9 V
|
Knee Impedance-Max |
|
250 Ω
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Reverse Test Voltage |
|
18 V
|
Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare BZX79-C24T/R with alternatives
Compare BZX79C24-AP with alternatives