BZX79C24-AP vs BZX79-C24,133 feature comparison

BZX79C24-AP Micro Commercial Components

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BZX79-C24,133 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS NXP SEMICONDUCTORS
Part Package Code DO-35 AXIAL
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, SC-40, 2 PIN
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICAL BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 70 Ω 70 Ω
Forward Voltage-Max (VF) 0.9 V
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e3
Knee Impedance-Max 250 Ω
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 24 V 24 V
Reverse Current-Max 0.05 µA
Reverse Test Voltage 18 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish MATTE TIN TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) 10 30
Voltage Tol-Max 5.79% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 1 2
Manufacturer Package Code SOD27
Factory Lead Time 4 Weeks
Operating Temperature-Min -65 °C

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Compare BZX79-C24,133 with alternatives