BZX55C33 vs BZX55-C33 feature comparison

BZX55C33 Vishay Semiconductors

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BZX55-C33 NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer VISHAY TELEFUNKEN NXP SEMICONDUCTORS
Part Package Code DO-35 DO-35
Package Description DO-35, 2 PIN HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 6.06% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 4 6
Rohs Code No
Additional Feature TEMPERATURE COEFFICIENT IS TYPICAL
Dynamic Impedance-Max 80 Ω
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reference Standard CECC50005-005
Reverse Current-Max 0.1 µA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Temp Coeff-Max 29.7 mV/°C

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Compare BZX55-C33 with alternatives