BZX55-C33 vs BZX55C33-AP feature comparison

BZX55-C33 NXP Semiconductors

Buy Now Datasheet

BZX55C33-AP Micro Commercial Components

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Part Package Code DO-35 DO-35
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature TEMPERATURE COEFFICIENT IS TYPICAL
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 80 Ω
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard CECC50005-005
Reference Voltage-Nom 33 V 33 V
Reverse Current-Max 0.1 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 10
Voltage Temp Coeff-Max 29.7 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 10 1
Pbfree Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Min -65 °C
Terminal Finish MATTE TIN

Compare BZX55-C33 with alternatives

Compare BZX55C33-AP with alternatives