BZX55-C33
vs
BZX55C33-AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRO COMMERCIAL COMPONENTS
Part Package Code
DO-35
DO-35
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
TEMPERATURE COEFFICIENT IS TYPICAL
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
80 Ω
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
CECC50005-005
Reference Voltage-Nom
33 V
33 V
Reverse Current-Max
0.1 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
10
Voltage Temp Coeff-Max
29.7 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
10
1
Pbfree Code
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Min
-65 °C
Terminal Finish
MATTE TIN
Compare BZX55-C33 with alternatives
Compare BZX55C33-AP with alternatives