BZX384-C27,115
vs
BZM55C27TR3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
VISHAY TELEFUNKEN
Part Package Code
SOD
MELF
Package Description
PLASTIC, SMD, SC-76, 2 PIN
O-LELF-R2
Pin Count
2
2
Manufacturer Package Code
SOD323
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Factory Lead Time
4 Weeks
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
300 Ω
JESD-30 Code
R-PDSO-G2
O-LELF-R2
JESD-609 Code
e3
e2
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
SMALL OUTLINE
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.3 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
27 V
27 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN SILVER
Terminal Form
GULL WING
WRAP AROUND
Terminal Position
DUAL
END
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Voltage Tol-Max
5%
7.037%
Working Test Current
2 mA
5 mA
Base Number Matches
2
1
Additional Feature
LOW NOISE
Case Connection
ISOLATED
Compare BZX384-C27,115 with alternatives
Compare BZM55C27TR3 with alternatives