BZX384-B3V6,115
vs
PZU3.6B1,115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOD
SOD
Package Description
PLASTIC, SMD, SC-76, 2 PIN
PLASTIC, SC-90, 2 PIN
Pin Count
2
2
Manufacturer Package Code
SOD323
SOD323F
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
600 Ω
90 Ω
JESD-30 Code
R-PDSO-G2
R-PDSO-F2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.3 W
0.31 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN
Terminal Form
GULL WING
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Voltage Tol-Max
2%
2%
Working Test Current
5 mA
5 mA
Base Number Matches
2
2
Reference Standard
IEC-60134
Compare BZX384-B3V6,115 with alternatives
Compare PZU3.6B1,115 with alternatives