BZX384-B3V6,115 vs BZX384-B3V6 feature comparison

BZX384-B3V6,115 NXP Semiconductors

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BZX384-B3V6 General Instrument Corp

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GENERAL INSTRUMENT CORP
Part Package Code SOD
Package Description PLASTIC, SMD, SC-76, 2 PIN
Pin Count 2
Manufacturer Package Code SOD323
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 600 Ω
JESD-30 Code R-PDSO-G2 R-PDSO-G2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.3 W 0.2 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Voltage Tol-Max 2% 2%
Working Test Current 5 mA 5 mA
Base Number Matches 2 4

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