BZV85-C16,113
vs
1N4745ARL
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Part Package Code
DO-4
DO-41
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS, CASE 59-10, 2 PIN
Pin Count
2
2
Manufacturer Package Code
SOD66
CASE 59-10
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Additional Feature
CAPACITANCE IS CAPTURED FROM THE GRAPH
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
16 Ω
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
CECC50005-010
Reference Voltage-Nom
16 V
16 V
Reverse Current-Max
0.05 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
15.4 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
15 mA
15.5 mA
Base Number Matches
1
2
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