BZV55C6V8-G
vs
BZV55C6V8-TP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SANGDEST MICROELECTRONICS (NANJING) CO LTD
MICRO COMMERCIAL COMPONENTS
Package Description
O-LELF-R2
O-LELF-R2
Reach Compliance Code
unknown
compliant
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.8 V
6.8 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
10
Voltage Tol-Max
5.88%
Working Test Current
5 mA
5 mA
Base Number Matches
2
1
Pbfree Code
Part Package Code
MELF
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
MCC
Additional Feature
HIGH RELIABILITY
Dynamic Impedance-Max
8 Ω
JESD-609 Code
e3
Knee Impedance-Max
150 Ω
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Operating Temperature-Min
-55 °C
Reverse Current-Max
0.0001 µA
Terminal Finish
Matte Tin (Sn)
Compare BZV55C6V8-G with alternatives
Compare BZV55C6V8-TP with alternatives