BZV55C6V8-TP vs BZV55-C6V8,115 feature comparison

BZV55C6V8-TP Micro Commercial Components

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BZV55-C6V8,115 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS NXP SEMICONDUCTORS
Part Package Code MELF MELF
Package Description O-LELF-R2 HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Samacsys Manufacturer MCC NXP
Additional Feature HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 8 Ω 15 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3 e3
Knee Impedance-Max 150 Ω
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 200 °C
Operating Temperature-Min -55 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.8 V 6.8 V
Reverse Current-Max 0.0001 µA 2 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Matte Tin (Sn) TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 10 30
Working Test Current 5 mA 5 mA
Base Number Matches 1 2
Manufacturer Package Code SOD80C
Factory Lead Time 4 Weeks
Voltage Temp Coeff-Max 4.5 mV/°C
Voltage Tol-Max 5%

Compare BZV55C6V8-TP with alternatives

Compare BZV55-C6V8,115 with alternatives