BZV55C6V8-TP
vs
BZV55-C6V8,115
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS
NXP SEMICONDUCTORS
Part Package Code
MELF
MELF
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
MCC
NXP
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
8 Ω
15 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Knee Impedance-Max
150 Ω
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
200 °C
Operating Temperature-Min
-55 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.8 V
6.8 V
Reverse Current-Max
0.0001 µA
2 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Matte Tin (Sn)
TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
10
30
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Manufacturer Package Code
SOD80C
Factory Lead Time
4 Weeks
Voltage Temp Coeff-Max
4.5 mV/°C
Voltage Tol-Max
5%
Compare BZV55C6V8-TP with alternatives
Compare BZV55-C6V8,115 with alternatives