BZV55C56
vs
BZV55-C56,135
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NEXPERIA
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
200 Ω
|
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e3
|
| Knee Impedance-Max |
1000 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.4 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
56 V
|
56 V
|
| Reverse Current-Max |
0.1 µA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Voltage Temp Coeff-Max |
67.2 mV/°C
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
2.5 mA
|
2 mA
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
O-LELF-R2
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BZV55C56 with alternatives
Compare BZV55-C56,135 with alternatives
-
BZV55-C56,135 vs BZV55C56TRL
-
BZV55-C56,135 vs BZV55-C56
-
BZV55-C56,135 vs BZV55-C56,115
-
BZV55-C56,135 vs BZV55C56-GT1
-
BZV55-C56,135 vs BZV55-C56T/R
-
BZV55-C56,135 vs BZV55C56TRL13
-
BZV55-C56,135 vs 933699730115
-
BZV55-C56,135 vs BZV55-C56135
-
BZV55-C56,135 vs BZV55C56-T1