BZV55C3V6-GT1
vs
BZV55C3V6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SANGDEST MICROELECTRONICS (NANJING) CO LTD
MICROSEMI CORP
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code
unknown
unknown
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5.56%
5.56%
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Pbfree Code
Part Package Code
DO-213AA
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
JEDEC-95 Code
DO-213AA
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare BZV55C3V6-GT1 with alternatives
Compare BZV55C3V6 with alternatives