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BZV55C39 vs BZV55-C36,135 feature comparison

BZV55C39 Microchip Technology Inc

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BZV55-C36,135 Nexperia

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC NEXPERIA
Package Description HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 O-LELF-R2
Reach Compliance Code compliant compliant
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 39 V 36 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5.13% 5%
Working Test Current 2 mA 2 mA
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Moisture Sensitivity Level 1
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Diodes » Zener Diodes
Diodes » Zener Diodes

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Compare BZV55-C36,135 with alternatives