BZV55C33
vs
BZV55-C33
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
GOOD-ARK ELECTRONICS CO LTD
Package Description
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
14 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
33 V
33 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
6.06%
5%
Working Test Current
2 mA
5 mA
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
80 Ω
Operating Temperature-Max
200 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare BZV55C33 with alternatives
Compare BZV55-C33 with alternatives