BZV55C2V7
vs
MMSZ4685-G3-18
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
VISHAY INTERTECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
14 Weeks
11 Weeks
Samacsys Manufacturer
Microchip
Vishay
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
JESD-30 Code
O-LELF-R2
R-PDSO-G2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
2.7 V
3.6 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Voltage Tol-Max
7.41%
5%
Working Test Current
5 mA
0.05 mA
Base Number Matches
2
1
Pbfree Code
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Operating Temperature-Min
-55 °C
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
10
Compare BZV55C2V7 with alternatives
Compare MMSZ4685-G3-18 with alternatives