BZV55C2V4-TP
vs
BZV55C2V4L1G
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
End Of Life
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
TAIWAN SEMICONDUCTOR CO LTD
|
Part Package Code |
MELF
|
|
Package Description |
O-LELF-R2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Samacsys Manufacturer |
MCC
|
|
Additional Feature |
HIGH RELIABILITY
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
2.4 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN OVER NICKEL
|
Terminal Form |
WRAP AROUND
|
|
Terminal Position |
END
|
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
1
|
1
|
Dynamic Impedance-Max |
|
85 Ω
|
Voltage Tol-Max |
|
5%
|
|
|
|
Compare BZV55C2V4-TP with alternatives
Compare BZV55C2V4L1G with alternatives