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BZV55C18FILM vs BZV55-C18,135 feature comparison

BZV55C18FILM STMicroelectronics

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BZV55-C18,135 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Package Description O-LELF-R2 HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Knee Impedance-Max 170 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -55 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 18 V 17.95 V
Reverse Current-Max 0.1 µA 0.05 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 19.8 mV/°C 16 mV/°C
Working Test Current 5 mA 5 mA
Base Number Matches 1 2
Rohs Code Yes
Part Package Code MELF
Pin Count 2
Manufacturer Package Code SOD80C
Factory Lead Time 4 Weeks
Dynamic Impedance-Max 45 Ω
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Voltage Tol-Max 5%
Diodes » Zener Diodes
Diodes » Zener Diodes

Compare BZV55C18FILM with alternatives

Compare BZV55-C18,135 with alternatives