BZV55C18FILM
vs
BZV55-C18,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
NEXPERIA
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Knee Impedance-Max
170 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Operating Temperature-Min
-55 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Reference Voltage-Nom
18 V
18 V
Reverse Current-Max
0.1 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
19.8 mV/°C
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
MELF
Pin Count
2
Manufacturer Package Code
SOD80C
Date Of Intro
1991-04-01
Samacsys Manufacturer
Nexperia
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Reference Standard
IEC-60134
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5%
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