BZV55C18 vs BZV55C18-T1 feature comparison

BZV55C18 HY Electronic Corp

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BZV55C18-T1 Sangdest Microelectronics (Nanjing) Co Ltd

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer HY ELECTRONIC CORP SANGDEST MICROELECTRONICS (NANJING) CO LTD
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Base Number Matches 3 1
Rohs Code No
Package Description O-LELF-R2
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JESD-30 Code O-LELF-R2
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 18 V
Surface Mount YES
Technology ZENER
Terminal Form WRAP AROUND
Terminal Position END
Voltage Tol-Max 6.41%
Working Test Current 5 mA

Compare BZV55C18 with alternatives

Compare BZV55C18-T1 with alternatives