BZV55-C5V6,135
vs
BZV55C5V6TR13
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
CENTRAL SEMICONDUCTOR CORP
|
Part Package Code |
MELF
|
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
O-LELF-R2
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD80C
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Factory Lead Time |
4 Weeks
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
40 Ω
|
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.4 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
5.6 V
|
5.6 V
|
Reverse Current-Max |
1 µA
|
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Temp Coeff-Max |
2.5 mV/°C
|
|
Voltage Tol-Max |
5%
|
|
Working Test Current |
5 mA
|
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare BZV55-C5V6,135 with alternatives
Compare BZV55C5V6TR13 with alternatives