BZV55-C5V6,135 vs BZV55-C5V6 feature comparison

BZV55-C5V6,135 NXP Semiconductors

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BZV55-C5V6 General Instrument Corp

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
parentfamilyid 1075975
Ihs Manufacturer NXP SEMICONDUCTORS GENERAL INSTRUMENT CORP
Part Package Code MELF
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Manufacturer Package Code SOD80C
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Factory Lead Time 4 Weeks
Total Weight 34.02
Category CO2 Kg 8.7 8.7
CO2 295.974
Compliance Temperature Grade Military: -65C to +200C
EU RoHS Version RoHS 2 (2015/863/EU)
EU RoHS Exemptions 7(c)-I
Candidate List Date 2024-06-27
CAS Accounted for Wt 100
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 1333-86-4, 7440-48-4, 7440-02-0, 1309-64-4, 1317-36-8
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V4.20
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 40 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 5.6 V 5.6 V
Reverse Current-Max 1 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max 2.5 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 2 7

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