BZV55-C4V3,115 vs BZV55C4V3 feature comparison

BZV55-C4V3,115 NXP Semiconductors

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BZV55C4V3 Continental Device India Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS CONTINENTAL DEVICE INDIA LTD
Part Package Code MELF
Package Description HERMETIC SEALED, GLASS PACKAGE-2 MELF-2
Pin Count 2
Manufacturer Package Code SOD80C
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 90 Ω 90 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 4.3 V 4.3 V
Reverse Current-Max 3 µA 3 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 2 28
Knee Impedance-Max 600 Ω
Reference Standard IATF 16949
Reverse Test Voltage 1 V

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