BZV55-C43,135
vs
JAN1N978BUR-1
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
MICROSEMI CORP
|
Part Package Code |
MELF
|
|
Package Description |
O-LELF-R2
|
HERMETIC SEALED, GLASS, LL34, MELF-2
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD80C
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Samacsys Manufacturer |
Nexperia
|
Microsemi Corporation
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.4 W
|
0.5 W
|
Reference Standard |
IEC-60134
|
MIL-19500/117
|
Reference Voltage-Nom |
43 V
|
51 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
2 mA
|
2.5 mA
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Additional Feature |
|
METALLURGICALLY BONDED
|
JEDEC-95 Code |
|
DO-213AA
|
Qualification Status |
|
Not Qualified
|
|
|
|
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