BZV55-C3V0/T3
vs
BZV55C3V0
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
NXP SEMICONDUCTORS
DC COMPONENTS CO LTD
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
MELF-2
Pin Count
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
JESD-30 Code
O-LELF-R2
JESD-609 Code
e3
Number of Elements
1
Number of Terminals
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
Qualification Status
Not Qualified
Reference Voltage-Nom
3 V
Reverse Current-Max
10 µA
Surface Mount
YES
Technology
ZENER
Terminal Finish
TIN
Terminal Form
WRAP AROUND
Terminal Position
END
Voltage Temp Coeff-Max
Voltage Tol-Max
5%
Working Test Current
5 mA
Base Number Matches
1
26
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