BZV55-C2V4,115 vs JANTXV1N4371CUR-1 feature comparison

BZV55-C2V4,115 NXP Semiconductors

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JANTXV1N4371CUR-1 Defense Logistics Agency

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS DEFENSE LOGISTICS AGENCY
Part Package Code MELF
Package Description HERMETIC SEALED, GLASS PACKAGE-2 MELF-2
Pin Count 2
Manufacturer Package Code SOD80C
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 100 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Qualified
Reference Voltage-Nom 2.4 V 2.7 V
Reverse Current-Max 50 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 2%
Working Test Current 5 mA 20 mA
Base Number Matches 1 1
Additional Feature METALLURGICALLY BONDED
JEDEC-95 Code DO-213AA
Reference Standard MIL-19500

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Compare JANTXV1N4371CUR-1 with alternatives